Descripción de la oferta
Main Tasks and responsibilities:We are seeking a Reliability Testing Engineer with a recently completed PhD and a strong background in thin-film reliability for implantable or bioelectronic systems, together with experience or familiarity in bonding rigid structures such as ASICs onto flexible polyimide-based thin-film devices. The candidate will contribute both to the development and optimization of bonding approaches for ASIC-integrated thin-film systems and to the design and execution of stability and reliability studies for packaged devices. You will combine hands-on experimental work with deep technical analysis, identify failure mechanisms across material, interface, bonding, and package levels, and collaborate with multidisciplinary teams to improve the robustness of next-generation neurotechnology. This is a highly attractive role for candidates who enjoy:Si está considerando enviar una solicitud, asegúrese de pulsar el botón de solicitar de abajo después de leer la descripción completa.building and refining reliability and stability test strategiesworking on thin-film systems that include bonding, packaging, and interconnect challengesunderstanding how failure emerges at interfaces rather than just within materialscombining hands-on experiments with rigorous data analysistranslating test outcomes into better design, process, bonding, and packaging decisionsAs Reliability Engineer, you will help define how ASIC-integrated thin-film neurodevices are assembled and evaluated under demanding conditions that matter for real use. Main responsabilities of the position are:Develop test methodologies for evaluating packaged devices in physiologically relevant and in vivo-inspired conditions, with attention to moisture ingress, delamination, interface degradation, bonding integrity, interconnect failure, and encapsulation stability.Design, develop, and optimize bonding approaches for rigid ASICs and related structures onto flexible polyimide-based thin-film devices, with attention to alignment, handling, interconnect integrity, and compatibility with downstream packaging and testing.Design and execute stability and reliability test plans for thin-film devices and packaged thin-film structures, including architectures integrated with or connected to ASIC-based systems.Support R&D efforts for ASIC-bonded thin-film structures to be assembled, handled, packaged, and tested in a repeatable and informative way.Analyze failure mechanisms at the material, interface, bonding, package, and system level, and translate findings into clear engineering recommendations.Support device assembly, bonding, and laboratory activities where needed, including handling of fragile structures and reliability test setups.Produce high-quality technical reports, maintain strong documentation and traceability, and communicate results clearly in cross-functional reviews.Help shape the long-term reliability strategy for next-generation implantable thin-film neurotechnology.Requirements:Education:PhD recently completed in Materials Science, Biomedical Engineering, Electrical Engineering, Micro/Nanotechnology, Microsystems, Bioelectronics, Neural Engineering, or a related discipline.You will likely be especially strong in this role if your PhD involved some combination of:implantable thin-film deviceschronic or accelerated reliability testingin vivo or explant-adjacent validationencapsulation / hermeticity / barrier-layer strategieschip-to-thin-film integration and rigid-to-flex bondingfailure analysis of flexible bioelectronic systemstest platforms for packaged microsystems in saline or physiological environmentsKnowledge and Professional Experience:Strong research background in thin-film reliability, especially where devices were tested under wet, physiological, chronic, in vivo, or implantation-relevant conditions.Experience with advanced packaging or encapsulation approaches for thin-film devices, especially where packaging enabled reliable operation and testing of bonded or hybridized structures.Experience with bonding, or strong familiarity with bonding, rigid structures such as ASICs onto flexible polyimide-based thin-film devices, including process integration, alignment, handling, and interface-related challenges.Demonstrated experience designing experiments for investigating failure mechanisms, extracting meaningful reliability metrics, and converting raw test data into engineering conclusions.Personal Competences:Clear technical communicator with strong ownership, autonomy, and a practical problem-solving mindset. Comfortable moving between hands-on lab work and structured technical analysis.Summary of conditions:Full time work (37,5h/week)Contract Length: Temporary (1 year)Location: Bellaterra (Barcelona)Salary will depend on qualifications and demonstrated experience.Support to the relocation issues.Life Insurance. xcskxlj Estimated Incorporation date: as soon as possible.
