Descripción de la oferta
Job Description Our partner is looking for a Senior
Thermal Engineer to own the thermal architecture for advanced
compute hardware, from die and package level analysis through
liquid cooling, sled design and rack level heat rejection. This is
a senior individual contributor role with strong technical
ownership. You will define thermal budgets, cooling requirements
and validation methods, working closely with mechanical, power and
hardware teams. Location: Barcelona, Spain, Hybrid Level: Senior
Responsibilities Own thermal design from silicon to rack level
Define thermal budgets for high power compute hardware Model die
hotspots, package spreading and board level thermal behaviour Run
CFD and conjugate heat transfer simulations Perform transient
analysis using realistic workload power profiles Design cold
plates, manifolds and liquid cooling loops Define flow rate,
pressure drop and coolant requirements Specify TIM stack, bond line
and thermal interface requirements Define sled and rack thermal
architecture Set coolant distribution, redundancy and failure
response requirements Own thermal validation on real hardware
Correlate simulation results with sensor and test measurements Work
with mechanical, power and cooling partners Support thermal
telemetry, throttling and power management decisions Requirements
8+ years of electronics thermal engineering experience Background
in high power computing, data centres or similar electronics
Thermal ownership of processors, GPUs, ASICs or FPGAs Strong
package level thermal analysis Strong CFD and thermal simulation
experience Icepak, Flotherm, Star CCM+ or equivalent Liquid cooling
and cold plate design Flow and pressure budget experience TIM
selection and bond line knowledge Thermal interface reliability
understanding Practical thermal validation experience Strong
simulation to measurement correlation skills Optional / Desired
2.5D, interposer or chiplet thermal design Two phase cooling
Immersion cooling Direct to chip cooling OCP rack cooling
experience Facility water interface design Electro thermal
simulation Power delivery or PDN collaboration Python for
automation and test analysis What’s in it for you? Flexible working
hours Hybrid model, 4 days office, 1 day from home 1 week per year
working from anywhere 25 days annual leave plus December 24 and 31
Monthly food allowance Private medical insurance Relocation bonus
Housing search support Visa support if required Family relocation
support Virtual shares Language classes Tax incentive, subject to
eligibility
